FIB & Microelectronic Device Debugging
Product Detail
At the forefront of semiconductor analysis and circuit optimization, our FIB & Microelectronic Device Debugging Services are designed to support engineers and researchers throughout the chip development lifecycle—particularly during post-fabrication testing and failure investigation. Utilizing advanced techniques such as FIB circuit editing, laser decapsulation, probe station signal extraction, and TEM sample preparation, we help you expose internal structures, modify circuit paths, and analyze defects with nanometer precision. Whether you are debugging a malfunctioning chip, validating design changes, or preparing ultra-thin cross-sections for high-resolution microscopy, our services offer precise, reliable solutions that accelerate your time to insight and improve yield outcomes.
- Decapsulation with Laser and Chemical Etching (SKU#ATFIB001)
Laser ablation combined with chemical etching is used to expose the chip while keeping it fully functional. This process is essential for accessing internal structures without damaging the device. - Passivation Layer Removal (SKU#ATFIB002)
Using FIB technology, specific areas of the passivation layer on a chip can be selectively removed to expose underlying metal structures. This is useful for signal observation, testing, and electrical characterization. - Metal Line Connection and Disconnection (SKU#ATFIB003)
FIB systems are used to open the upper passivation layer and expose two target metal lines. These lines can then be connected using platinum (Pt) deposition via ion beam, enabling quick prototyping or circuit modification. This significantly reduces chip development time. - Probe Test Point Formation (SKU#ATFIB004)
In complex IC circuitry, FIB can create test access points at any desired location. These points can then be used with a probe station or electron beam systems to directly observe and analyze internal IC signals. - Cross-sectional Analysis (SKU#ATFIB005)
FIB enables precise cross-sectioning at designated locations within the IC chip. This allows for detailed observation of internal material structures and defects, which aids IC designers in understanding and verifying functional aspects of the chip design. - TEM Sample Preparation (SKU#ATFIB006)
Preparing high-quality thin film samples for transmission electron microscopy (TEM) or high-resolution electron microscopy. These samples are taken from nanoscale or microscale regions of interest, including:- IC chips
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Nanomaterials
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Coated particles or modified surfaces
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Fiber-like materials (both cross-section and longitudinal cuts)
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Multilayer thin films or interface-rich materials
When to Use Each IC Analysis Service
|
Situation / Question |
Use This Service | Purpose |
|---|---|---|
| 1. Need to expose the chip die for analysis, but keep it functional? | Decapsulation with Laser and Chemical Etching | To remove the chip packaging while preserving internal circuitry for further testing or modification. |
| 2. Need to access internal metal layers for probing or measurement? | Passivation Layer Removal | To selectively remove the insulating passivation layer using FIB, allowing contact with internal signals. |
| 3. Need to connect or isolate specific metal lines for circuit modification or fault isolation? | Metal Line Connection and Disconnection | To either short two circuit paths with Pt deposition or cut them using FIB, useful for debugging or design validation. |
| 4. Need to observe internal signals or test specific circuit nodes directly? | Probe Test Point Formation | To create probe pads or test points using FIB, allowing direct access with probe stations or E-beam systems. |
| 5. Need to check for defects or verify material structure inside the chip? | Cross-sectional Analysis | To slice through the IC at a specific location and inspect internal structures or failure sites. |
| 6. Need to analyze nanostructures or material interfaces under a TEM? | TEM Sample Preparation | To extract ultra-thin, high-precision lamellae from the chip for advanced electron microscopy. |
If you're unsure which service best suits your needs, please contact us. Our technical team will be happy to recommend the most appropriate solution based on your specific requirements.