Wafer Heating Module
Product Detail
The wafer heating module is a key component in semiconductor process flows — wafer annealing, bonding, photoresist coating, etching, vapor deposition, and other critical steps. It provides a stable thermal field and precise across-plate temperature uniformity so the wafer meets its heating requirement in every temperature zone, supporting semiconductor device manufacturing and R&D. Each module is built to order: 2–12 inch sizes, RT to 600 °C with ±0.1 °C stability, and flatness down to 3 µm depending on material.
Key features
- Custom 2–12 inch sizesModules are specified per order in 2 / 4 / 6 / 8 / 10 / 12 inch formats; the model designation is Custom.
- RT to 600 °C, ±0.1 °CHeating from room temperature to 600 °C with ±0.1 °C temperature stability for uniform wafer processing.
- Flatness ≤10 µm · down to 3 µm by materialPlate flatness is ≤10 µm, achievable down to 3 µm depending on the plate material.
- Aluminum alloy, stainless steel, InvarPlate materials include aluminum alloy, stainless steel, and Invar alloy, among others, selected per process.
- Atmosphere / vacuumSpecified for operation in atmosphere or vacuum environments.
- Optional cooling and bonding forceCooling systems (water cooling, gas cooling, etc.) are optional, and a bonding force of 0–100 kN is available as an option for bonding processes.
Product specifications
| Parameter | Custom |
|---|---|
| Model # | Custom |
| SKU # | EIWHM001 |
| Wafer Size | 2 / 4 / 6 / 8 / 10 / 12 inch |
| Temperature Range | RT ~ 600 °C |
| Temperature Stability | ±0.1 °C |
| Material | Aluminum alloy, stainless steel, Invar alloy, etc. |
| Flatness | ≤10 µm; down to 3 µm, material-dependent |
| Operating Environment | Atmosphere / vacuum |
| Cooling System | Optional — water cooling, gas cooling, etc. |
| Bonding Force | Optional — 0 ~ 100 kN |
FAQ
What processes is it used for?
Wafer heating modules serve key semiconductor process steps such as wafer annealing, bonding, photoresist coating, etching, and vapor deposition, providing a stable thermal field and precise across-plate uniformity.
How is it customized?
Every module is built to order — wafer size (2–12 inch), plate material (aluminum alloy, stainless steel, Invar alloy, etc.), flatness grade, cooling, and mounting are specified per order and confirmed at quotation.
How flat is the plate?
Flatness is specified at ≤10 µm and can reach 3 µm depending on the plate material.
Can it work in vacuum?
Yes — the module is specified for atmosphere or vacuum environments. Feedthrough and mounting details are confirmed at quotation.
Does it support wafer bonding?
A bonding force of 0–100 kN is listed as an option for bonding processes; cooling systems (water or gas cooling) are also optional.
What’s included?
As a custom-built module, the OEM materials list no fixed standard configuration; the supplied configuration and options are confirmed at quotation.
How do I order?
The wafer heating module is supplied by quotation: request via this page with your wafer size, temperature, and process details, and our engineers reply with a proposed build, pricing, and lead time.
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Disclaimer: ACS Material, LLC believes the information on this page is accurate and represents the best and most current information available to us. Specifications reflect the manufacturer's current datasheet; idealized values are benchmarks and final configurations are confirmed at quotation — always refer to the model datasheet for guaranteed ratings. ACS Material makes no representations or warranties, express or implied, regarding suitability for any purpose, and will not be responsible for damages resulting from use of or reliance upon this information.