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Levon™ HP6 Precision Vacuum Hotplate

In stock
SKU# LVHP060F

Product Detail

Levon™ HP6 Precision Vacuum Hotplate is a vacuum hot plate with a Ø170 mm circular heating plate for wafers up to 6 inches, a temperature control range of RT to 250°C, 0.1°C temperature resolution, ±0.2°C temperature control precision (after the temperature is stable) and ≤1% temperature uniformity.

Levon HP6 vacuum hot plate with blue body, silver anodized lid, digital temperature controller and push buttons
Levon™ HP6 Precision Vacuum Hotplate — image shown for reference.

The HP6 has a manually activated vacuum substrate chuck with a close-contact resist baking mode, a digital temperature controller with an optional linear control function, a thermal-radiation-sealed lid over a hard-anodized aluminum heating plate and an independent control circuit for the heating output. The full anodized aluminum body has a recessed heating element design with compact dimensions (370 × 270 × 126 mm, W × D × H) for glovebox integration. Vacuum is connected at the rear-panel outlet (6 mm outer diameter); the vacuum input requirement is 0.04–0.09 MPa.

Why choose the HP6

Vacuum substrate chuckManually activated vacuum substrate chuck with a close-contact resist baking mode.
Digital temperature controllerDigital temperature controller with an optional linear control function; ±0.2°C control precision after the temperature is stable.
Thermal-radiation-sealed lidThermal-radiation-sealed lid over a hard-anodized aluminum heating plate.
Independent heating circuitIndependent control circuit for the heating output.
Glovebox integrationRecessed heating element design with compact dimensions for glovebox integration.
Anodized aluminum bodyFull anodized aluminum body structure; 370 × 270 × 126 mm (W × D × H).
Heating plate
Ø170 mm
Temperature range
RT to 250°C
Control precision (after stabilization)
±0.2°C
Uniformity
≤1%
Wafer size
Up to 6 inches

Specifications General — HP6

ParameterSpecification
BrandLevon™ by ACS Material
ModelHP6
SKU #LVHP0600
Product TypeVacuum hotplate
Heating plateØ170 mm circular, hard-anodized aluminum
Applicable substrate sizeWafers up to 6 inches
Temperature control rangeRT to 250°C
Temperature resolution0.1°C
Temperature control precision±0.2°C (after the temperature is stable)
Temperature uniformity≤1%
Temperature controllerDigital temperature controller with optional linear control function
Vacuum chuckManually activated vacuum substrate chuck; close-contact resist baking mode
Vacuum interfaceRear-panel outlet, 6 mm outer diameter
Vacuum input requirement0.04–0.09 MPa
LidThermal-radiation-sealed lid
BodyFull anodized aluminum body; recessed heating element design for glovebox integration
Heating outputIndependent circuit control
Power input220 V, 1,000 W
Dimensions [W × D × H]370 × 270 × 126 mm
PackingCarton packaging
Warranty1-year product warranty

Package contents

Supplied with the instrumentQty
Levon™ HP6 Precision Vacuum Hotplate main unit1

External utilities, where required, are supplied by the user. Package contents reflect the current published configuration; the itemized bill of materials is confirmed on the quotation.

Where it fits

For close-contact resist baking of wafers up to 6 inches on a vacuum-held Ø170 mm plate from RT to 250°C, including glovebox setups. For square heating plates, see the HP5 (150 × 150 mm) or the HP10 (220 × 220 mm). The HP6 is designed for compact semiconductor research.

Frequently asked questions

What temperature range and precision does the HP6 offer?

RT to 250°C with 0.1°C resolution; temperature control precision ±0.2°C after the temperature is stable; temperature uniformity ≤1%.

How is the wafer held?

By a manually activated vacuum substrate chuck with a close-contact resist baking mode. Vacuum is connected at the rear-panel outlet (6 mm outer diameter); the vacuum input requirement is 0.04–0.09 MPa.

Which substrate sizes fit?

Wafers up to 6 inches on the Ø170 mm circular heating plate.

Can it be used in a glovebox?

Yes, the recessed heating element design with compact dimensions (370 × 270 × 126 mm) is intended for glovebox integration.

What power input does it need?

220 V, 1,000 W.

Levon™ HP5 Compact Hotplate (150 × 150 mm) — compact hot plate, 150 × 150 mm heating plate, RT to 300°C.
Levon™ HP10 Compact Hotplate (220 × 220 mm) — 220 × 220 mm hot plate, RT to 300°C or RT to 400°C.
Levon™ HP100 Programmable Hotplate — programmable touchscreen hot plate with auto-lift, HP100-SE and HP100-PE configurations.
Levon™ AC200 Programmable Servo Spin Coater — servo spin coater family (AC200-S-PP / -SE / -PE / -SE-PLUS) for fragments to 8-inch wafers.
Levon™ is a trademark of ACS Material, LLC. Disclaimer: ACS Material, LLC believes the information on this page is accurate and represents the best and most current information available to us. Specifications reflect the current published data; final configurations are confirmed at quotation — always refer to the model datasheet for confirmed model-specific specifications, never exceed the rated temperature of the instrument, and follow your laboratory’s safety procedures for hot surfaces, heated substrates and the handling of resists and solvents. ACS Material makes no representations or warranties, express or implied, regarding suitability for any purpose, and will not be responsible for damages resulting from use of or reliance upon this information.