Levon™ AC200 Programmable Servo Spin Coater
Product Detail
Levon™ AC200 Programmable Servo Spin Coater is a family of servo-driven programmable spin coaters with an industrial design, PLC control, a 7-inch full-color touchscreen and a PC transparent cover, handling substrates from fragments to 8-inch wafers. Four configurations are available — AC200-S-PP, AC200-SE, AC200-PE and AC200-SE-PLUS — and custom process configurations are quoted on request.
Every AC200 standard configuration is driven by a servo motor, runs single steps of up to 3,000 s at 0.1 s resolution and can be recessed into a glovebox to reduce the operating height. The configurations differ in housing and process cup, speed and acceleration, standard trays, size and options; each has its own specification block below, and values are not interchangeable between configurations.
Why choose the AC200
Specifications General — AC200 series
| Parameter | Specification |
|---|---|
| Brand | Levon™ by ACS Material |
| Models | AC200-S-PP / AC200-SE / AC200-PE / AC200-SE-PLUS |
| SKU # | LVAC20PP / LVAC20SE / LVAC20PE / LVAC20PL |
| Product Type | Programmable servo spin coater |
| Drive | Servo motor |
| Control and operation | PLC control, 7-inch full-color touchscreen |
| Cover | PC transparent cover |
| Single-step duration | 3,000 s (maximum) |
| Time resolution | 0.1 s |
| Substrate size range | Fragments to 8-inch wafers; see the model-specific substrate limits |
| Installation | Can be recessed into a glovebox to reduce the operating height |
| Warranty / quality assurance | AC200-S-PP / AC200-SE: 1-year product warranty; AC200-PE / AC200-SE-PLUS: 1-year product quality assurance |
Model comparison AC200 configurations
| Parameter | AC200-S-PP | AC200-SE | AC200-PE | AC200-SE-PLUS |
|---|---|---|---|---|
| SKU # | LVAC20PP | LVAC20SE | LVAC20PE | LVAC20PL |
| Spin speed | 20–10,000 rpm | 20–10,000 rpm (no load) | Max. 10,000 rpm (no load) | Max. 8,000 rpm (no load) |
| Acceleration | 20–50,000 rpm/s | 20–50,000 rpm/s (no load) | Max. 50,000 rpm/s (no load) | Max. 10,000 rpm/s (no load) |
| Speed resolution | 1 rpm | 1 rpm | 1 rpm | ±1 rpm |
| Substrate size range | 1 cm debris to max. 8-inch standard wafers | Fragments to 8-inch circular wafers | Fragments smaller than 1 cm to 8-inch circular substrates | Fragments smaller than 1 cm to max. 8-inch standard wafers |
| Housing / process cup | PP housing, PC transparent cover | HDPE process chamber, PC cover | HDPE cup, PC cover | HDPE cup, PC cover |
| Dimensions [W × D × H] | 385 × 540 × 300 mm | 412 × 510 × 295 mm | 415 × 500 × 300 mm | 598 × 556 × 286 mm |
| Packing | Carton packaging | Wooden case | Wooden case | Wooden case |
AC200-S-PP SKU LVAC20PP
The AC200-S-PP has a PP housing with a PC transparent cover, a digital display of the vacuum adsorption pressure with adjustable vacuum pressure, and integrated backside cleaning and edge debonding functionality for industrial-grade applications.
| Parameter | Specification |
|---|---|
| Programs | 100 recipes with 100 steps each; expandable capacity available |
| Dispensing | Integrated 4-channel auto-dispensing ports; upgradeable to multi-channel dispensing (optional) |
| Standard trays | 10 mm, 25 mm, 2-inch |
| Vacuum | Digital display of vacuum adsorption pressure; adjustable vacuum pressure |
| Vacuum input requirement | Minimum vacuum flow rate 15 L/min or more |
| Backside cleaning and edge debonding | Integrated |
Uniformity data — AC200-S-PP
| Wafer size | Within-wafer | Wafer-to-wafer | Film thickness | Photoresist |
|---|---|---|---|---|
| 4-inch | ±0.49% | ±0.55% | 500 nm | RZJ304 (<10 CP) |
| 6-inch | ±0.76% | ±0.91% | 1300 nm | AZ1500 (20 CP) |
| 8-inch | ±0.92% | ±1.10% | 1350 nm | AZ1500 (20 CP) |
Values apply only to the listed wafer sizes, film thicknesses and photoresists.
AC200-SE SKU LVAC20SE
The AC200-SE offers bidirectional rotation, an HDPE process chamber with a solvent-resistant polycarbonate (PC) transparent cover, and options for BSR and EBR and an integrated rinse/develop module with splash guard.
| Parameter | Specification |
|---|---|
| Speed accuracy | <±1 rpm |
| Process time setting | 0–3,000 s/step |
| Time setting accuracy | 0.1 s |
| Rotational coating uniformity | <±3% within 6 inches |
| Rotation | Bidirectional |
| Programs | 100 groups of 100 steps; more can be extended |
| Dispensing | Four-way automatic dispensing port; upgradeable to multi-way automatic dispensing |
| Available vacuum tray diameters | 10 mm, 25 mm, 2-inch |
| Options | BSR and EBR can be added; integrated rinse/develop module with splash guard (optional) |
Uniformity data — AC200-SE
| Wafer size | Within-wafer | Wafer-to-wafer | Film thickness | Photoresist |
|---|---|---|---|---|
| 4-inch | ±0.49% | ±0.55% | 500 nm | RZJ304 dilution (<10 CP) |
| 6-inch | ±0.76% | ±0.91% | 1300 nm | AZ1500 (20 CP) |
| 8-inch | ±0.92% | ±1.10% | 1350 nm | AZ1500 (20 CP) |
Values apply only to the listed wafer sizes, film thicknesses and photoresists.
AC200-PE SKU LVAC20PE
The AC200-PE has an HDPE cup with a solvent-resistant PC transparent cover and is supplied with vacuum trays from 10 mm up to 6-inch diameter as standard; BSR and EBR and spill-proof cleaning and developing functions can be added.
| Parameter | Specification |
|---|---|
| Speed precision | <±1 rpm |
| Process time setting | 0–3,000 s/step |
| Time setting precision | 0.1 s |
| Programs | 100 recipes with 100 steps each; more can be extended |
| Dispensing | Four-way automatic dispensing port; upgradeable to multi-way automatic dispensing |
| Vacuum trays (standard) | 10 mm, 25 mm, 2-inch, 4-inch or 6-inch diameter |
| Weight | 20 kg |
| Options | BSR and EBR can be added; spill-proof cleaning and developing functions can be added |
Uniformity data — AC200-PE
| Wafer size | Within-wafer | Wafer-to-wafer | Film thickness | Photoresist |
|---|---|---|---|---|
| 4-inch | ±0.49% | ±0.55% | 500 nm | RZJ304 (<10 CP) |
| 6-inch | ±0.76% | ±0.91% | 1300 nm | AZ1500 (20 CP) |
| 8-inch | ±0.92% | ±1.10% | 1350 nm | AZ1500 (20 CP) |
Values apply only to the listed wafer sizes, film thicknesses and photoresists.
AC200-SE-PLUS SKU LVAC20PL
The AC200-SE-PLUS provides forward and reverse rotation, an HDPE cup with a solvent-resistant PC transparent cover, two published power configurations and rear vacuum and waste disposal interfaces.
| Parameter | Specification |
|---|---|
| Rotation | Forward and reverse |
| Weight | 30 kg |
| Power input — 110 V type | 100–120 V, single-phase, 1.7 kW |
| Power input — 220 V type | 200–230 V, single-phase, 1.7 kW |
| Vacuum input requirement | 0.06–0.09 MPa; minimum vacuum flow rate >15 L/min |
| Vacuum interface | Equipment backboard outlet, 6 mm outer diameter |
| Waste disposal interface | Equipment backboard outlet, 19 mm outer diameter |
| Options | BSR and EBR can be added; spill-proof cleaning and developing functions can be added |
Custom configurations Quoted on request — AC200-DEV-CTM / AC200-EBR-CTM / AC200-COT-CTM
Three custom AC200-based process systems are available on quotation. Each combines a servo spin module and an HDPE process cup or inner cavity with an automatic swing arm and pressure-tank liquid supply; the published values of each system are listed below. Supply utilities and final configuration are confirmed on the quotation.
| Parameter | AC200-DEV-CTM | AC200-EBR-CTM | AC200-COT-CTM |
|---|---|---|---|
| Process | Automatic desktop developer | Automatic desktop spin coater — edge removal + back washing | Automatic desktop spin coater — dispensing + back washing |
| Substrate range | From fragments to wafers up to 8 inches | Standard wafers up to 8 inches | Standard wafers up to 8 inches |
| Maximum speed | 10,000 rpm (no load) | ||
| Maximum acceleration | 50,000 rpm/s (no load) | ||
| Speed accuracy | ±1 rpm | ||
| Speed resolution | 0.1 rpm | ||
| Process cup / inner cavity | HDPE cup | HDPE inner cavity | HDPE inner cavity |
| Chucks / load trays | PPS vacuum suction or limited-position chuck/tray, selected according to substrate size; listed sizes: 10 mm, 25 mm, and 2–6 inches | ||
| Programs | 100 groups with 100 steps each; max. 3,000.0 s per step, 0.1 s resolution; programs can be saved, invoked, modified and deleted | ||
| Machine size [L × W × H] | 800 × 550 × 550 mm, excluding pressure tanks | 710 × 550 × 550 mm, excluding pressure tanks | 700 × 550 × 500 mm, excluding pressure tanks |
| Installation size [L × W × H] | 1100 × 850 × 850 mm, excluding pressure tanks | 1010 × 850 × 850 mm, excluding pressure tanks | 1000 × 850 × 850 mm, excluding pressure tanks |
| Machine weight | 45 kg | 35 kg | 45 kg |
Swing arm: Automatic development swing arm: aluminum alloy coated with PTFE; automatic lifting and swinging; swinging speed 0–30°/s, adjustable; nozzle fixture height manually adjustable
Pipeline: 3 channels: developing liquid, pure water, nitrogen; retract function; adjustable liquid flow rate
Liquid supply: Developing liquid and pure water: one 10 L pressure tank each, with low liquid level alarm sensor (tank Ø330 × 580 mm)
Nozzles: Cylindrical or fan-shaped nozzle for developing liquid, pure water and nitrogen
Acceptance criteria: Linear patterns developed with 2.38% TMAH using 2 PUDDLE, following adhesion promotion and exposure; line width not smaller than 5 µm; CD uniformity not greater than ±4% within and between chips. Sampling: 4-inch wafers, 5 points per wafer, 3 wafers.
Edge removal swing arm: Aluminum alloy; automatic lifting and swinging; nozzle fixture height manually adjustable; edge removal distance 3–5 mm; edge removal accuracy ±0.5 mm; wafers 3 to 8 inches
Back washing: Aluminum alloy back washing fixture, height manually adjustable; wafers 4 to 8 inches
Pipeline and supply: 2 channels (edge removal liquid, back washing liquid) from two 10 L pressure tanks with low liquid level sensors (tank Ø330 × 580 mm); retract function; adjustable liquid flow rate
Acceptance criteria: Using AZ1500 (20 cp): Step 1, 500 rpm for 5 s at 500 rpm/s; Step 2, 2,500 rpm for 35 s at 2,000 rpm/s. Prebake: 100°C for 100 s. The resulting film thickness is approximately 1.3 µm. After prebake, film thickness within 5 mm of the edge is measured using an optical film-thickness meter (step meter). Reported criteria by wafer diameter: 4-inch <±1.5%, 6-inch <±2%, 8-inch <±2.5%. Sampling: 5 points for 4-inch wafers, 9 points for 6-inch wafers and 13 points for 8-inch wafers; 3 wafers of each size.
Dispensing swing arm: Aluminum alloy; automatic lifting and swinging; nozzle fixture height manually adjustable
Back washing: Aluminum alloy back washing fixture, height manually adjustable; wafers 4 to 8 inches
Dispensing liquid supply: The bottle is placed directly into a 10 L pressure tank (liquid is not poured into the tank); maximum tank size 10 L, inner barrel height 285 mm, inner diameter 209 mm; size determined by the customer’s bottle
Back washing liquid supply: Separate 10 L pressure tank with low liquid level sensor (tank Ø330 × 580 mm); retract function; adjustable liquid flow rate
Acceptance criteria: Using AZ1500 (20 cp): Step 1, 500 rpm for 5 s at 500 rpm/s; Step 2, 2,500 rpm for 35 s at 2,000 rpm/s. Prebake: 100°C for 100 s. The resulting film thickness is approximately 1.3 µm. After prebake, film thickness within 5 mm of the edge is measured using an optical film-thickness meter (step meter). Reported criteria by wafer diameter: 4-inch <±1.5%, 6-inch <±2%, 8-inch <±2.5%. Sampling: 5 points for 4-inch wafers, 9 points for 6-inch wafers and 13 points for 8-inch wafers; 3 wafers of each size.
| Configuration | Description | Image |
|---|---|---|
| AC200-DEV-CTM | Automatic Desktop Developer (custom configuration, quoted on request) |  |
| AC200-EBR-CTM | Automatic Desktop Spin Coater (Edge Removal + Back Washing) (custom configuration, quoted on request) |  |
| AC200-COT-CTM | Automatic Desktop Spin Coater (Dispensing + Back Washing) (custom configuration, quoted on request) |  |
Images show reference configurations. Custom systems are quoted on request; the final configuration, utilities and price are confirmed on the quotation.
Accessories Vacuum trays
| Accessory | Description | Image |
|---|---|---|
| Vacuum trays | AC200-S-PP: standard trays in 10 mm, 25 mm and 2-inch sizes. AC200-SE: available tray diameters are 10 mm, 25 mm and 2-inch. AC200-PE: standard tray diameters are 10 mm, 25 mm, 2-inch, 4-inch or 6-inch. |  |
Accessory images shown for reference; the supplied configuration is confirmed on the quotation.
Package contents
| Supplied with the instrument | Qty |
|---|---|
| Levon™ AC200 main unit in the ordered configuration (AC200-S-PP, AC200-SE, AC200-PE or AC200-SE-PLUS) | 1 |
| Standard trays — AC200-S-PP only: 10 mm, 25 mm and 2-inch sizes | 3 sizes |
| Standard vacuum tray — AC200-PE only: 10 mm, 25 mm, 2-inch, 4-inch or 6-inch diameter | As quoted |
Accessories are listed above. External utilities, where required, are supplied by the user. Package contents reflect the current published configuration; the itemized bill of materials is confirmed on the quotation.
Where it fits
Frequently asked questions
Which AC200 configuration should I choose?
All four share the servo drive, PLC control, 7-inch touchscreen, PC transparent cover and substrate capability up to 8-inch. They differ in housing/process cup, speed and acceleration, standard trays, size and options; see the model comparison and the configuration blocks on this page.
What speed and acceleration are published?
AC200-S-PP: 20–10,000 rpm and 20–50,000 rpm/s. AC200-SE: 20–10,000 rpm and 20–50,000 rpm/s (no load). AC200-PE: max. 10,000 rpm and 50,000 rpm/s (no load). AC200-SE-PLUS: max. 8,000 rpm and 10,000 rpm/s (no load).
Is uniformity data available?
Yes, for AC200-S-PP, AC200-SE and AC200-PE: within-wafer and wafer-to-wafer data for 4-, 6- and 8-inch wafers at the listed film thicknesses and photoresists. The AC200-SE specification also lists rotational coating uniformity <±3% within 6 inches.
Can the AC200 be installed in a glovebox?
All four configurations can be recessed into a glovebox to reduce the operating height.
Are developing, edge removal or back washing systems available?
Yes, as custom configurations quoted on request: AC200-DEV-CTM (automatic desktop developer), AC200-EBR-CTM (edge removal + back washing) and AC200-COT-CTM (dispensing + back washing).