Levon™ MA200-BE Mask Aligner
Product Detail
Levon™ MA200-BE Mask Aligner is a mask aligner with an exposure central wavelength of 365 nm, an 8-inch exposure area, an exposure resolution of 0.8–1.2 µm and a registration accuracy of 0.5 µm.
The MA200-BE has four selectable exposure modes: hard contact, soft contact, proximity and vacuum contact. The exposure irradiance is >30 mW/cm² (adjustable), the illuminance uniformity is ≤2% over a 4-inch area and ≤3% over an 8-inch area, and the exposure settings cover 0–999.9 s.
On the MA200-BE, the alignment system is an optical microscope with a high-definition CCD, with a microscope magnification of 150X–720X (adjustable). The relative travel range of the wafer to the mask is X, Y: ±5 mm and θ: ±6°. Auto-leveling and auto-focusing mechanisms are included, and the MA200-BE is equipped with wafer fragment handling capability.
The MA200-BE supports reticle sizes of 5″ × 5″, 7″ × 7″, 9″ × 9″ and a maximum allowable working thickness (design) of 0.1–3 mm (customizable fixtures supported). The unit measures 600 × 1000 × 1620 mm (W × D × H) and is packed in a paper case.
Why choose the MA200-BE
Specifications General — MA200-BE
| Parameter | Specification |
|---|---|
| Brand | Levon™ by ACS Material |
| Model | MA200-BE |
| SKU # | LVMA2B00 |
| Product Type | Mask aligner |
| Exposure area | 8-inch |
| Supported reticle size | 5″ × 5″, 7″ × 7″, 9″ × 9″ |
| Maximum allowable working thickness (design) | 0.1–3 mm (customizable fixtures supported) |
| Wafer fragments | Wafer fragment handling capability |
| Leveling and focusing | Auto-leveling and auto-focusing mechanisms |
| Dimensions [W × D × H] | 600 × 1000 × 1620 mm |
| Packing | Paper case |
| Warranty | 1-year product warranty |
Exposure and alignment MA200-BE
| Parameter | Specification |
|---|---|
| Exposure central wavelength | 365 nm |
| Exposure resolution | 0.8–1.2 µm |
| Exposure irradiance | >30 mW/cm² (adjustable) |
| Illuminance uniformity | ≤2% (over 4-inch area), ≤3% (over 8-inch area) |
| Exposure settings | 0–999.9 s |
| Selectable exposure modes | Hard contact, soft contact, proximity and vacuum contact |
| Registration accuracy | 0.5 µm |
| Relative travel range (wafer to mask) | X, Y: ±5 mm; θ: ±6° |
| Alignment system | Optical microscope + high-definition CCD |
| Microscope magnification | 150X–720X, adjustable |
Package contents
| Supplied with the instrument | Qty |
|---|---|
| Levon™ MA200-BE main unit | 1 |
External utilities, where required, are supplied by the user. Package contents reflect the current published configuration; the itemized bill of materials is confirmed on the quotation.
Where it fits
Frequently asked questions
Which exposure modes are available?
Hard contact, soft contact, proximity and vacuum contact.
What are the exposure specifications?
Exposure central wavelength 365 nm, exposure resolution 0.8–1.2 µm, exposure irradiance >30 mW/cm² (adjustable), illuminance uniformity ≤2% over a 4-inch area and ≤3% over an 8-inch area, exposure settings 0–999.9 s, exposure area 8-inch.
How is alignment done?
With an optical microscope and a high-definition CCD (magnification 150X–720X, adjustable); the registration accuracy is 0.5 µm and the relative travel range of the wafer to the mask is X, Y: ±5 mm and θ: ±6°.
Which masks and substrates fit?
Supported reticle sizes are 5″ × 5″, 7″ × 7″, 9″ × 9″; the maximum allowable working thickness (design) is 0.1–3 mm (customizable fixtures supported), and wafer fragments can be handled.
How large is the unit?
600 × 1000 × 1620 mm (W × D × H); it is packed in a paper case.