Thermal Conductive Potting Gel
Thermal Conductive Potting Gel
Product Detail
The dual-component thermal conductive gel filling material with a thermal conductivity ranging from 0.4 to 4W/m*K is suitable for filling, insulation, and potting. The material requires manual mixing of components A and B, which can cure at room temperature or high temperature. After curing, it exhibits good thermal conductivity, insulation, and shock absorption. Additionally, the thermally conductive potting adhesive adopts an organic silicon formulation system, which is non-toxic, odorless, non-corrosive, and complies with RoHS directives and relevant environmental protection requirements.
1. Features
- Good insulation and high/low temperature resistance.
- Flame retardant rating of UL94 V0
- Good maneuverability and flexibility
2. Characterizations
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Before Curing |
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Tube 1 |
Tube 2 |
Testing Standard |
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Color |
Blue/Optional |
White |
Visual inspection |
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Viscosity @ 25℃ Rotor |
2.5*103 cps |
2.0*103 cps |
ASTM D445 |
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Density |
1.7 g/cc |
ASTM D792 |
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After Curing |
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Thermal Conductive |
0.8 W/m*K |
ISO22007-2 |
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Size |
600ml |
- |
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Hardness |
50 ShoreA |
ASTM D792 |
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Flame Retardant Rating |
V0 |
ASTM D2240 |
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Surface Dry Time @ 25℃ |
90min |
UL94 |
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Curing Time @ 25℃ |
24 h |
Manual Tester |
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Tensile Strength |
0.3 MPa |
Hardness Tester |
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Elongation at Time |
30% |
ASTM D412 |
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Breakdown Voltage |
10 kV/mm |
ASTM D412 |
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Volume Resistivity |
>1012 Ohm*cm |
ASTM D257 |
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D4~D10 content |
<100 ppm |
GC |
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Recommend Operating Temperature Range |
-40 ~ +150 ℃ |
- |
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Disclaimer: ACS Material, LLC believes that the information in this Technical Data Sheet is accurate and represents the best and most current information available to us. ACS Material makes no representations or warranties either express or implied, regarding the suitability of the material for any purpose or the accuracy of the information contained within this document. Accordingly, ACS Material will not be responsible for damages resulting from use of or reliance upon this information.